US Patent Issued to Apple on April 22 for "High density interconnection using fanout interposer chiplet" (California Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,549, issued on April 22, was assigned to Apple Inc. (Cupertino, Calif.).

"High density interconnection using fanout interposer chiplet" was invented by Jun Zhai (Cupertino, Calif.), Chonghua Zhong (Cupertino, Calif.) and Kunzhong Hu (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multiple component package structures are described in which an interposer chiplet is integrated to provide fine routing between components. In an embodiment, the interposer chiplet and a plurality of conductive vias are encapsulated in an encapsulation layer. A first plurality of terminals of the first and second components may be in electrical connection ...