ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,846, issued on April 1, was assigned to Apple Inc. (Cupertino, Calif.).
"System packaging for millimeter wave antennas" was invented by Sidharth S. Dalmia (San Jose, Calif.), Wansuk Yun (Sunnyvale, Calif.) and Flynn P. Carson (Redwood City, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency package includes a first portion of an antenna array module, a second portion of the antenna array module, and a flexible cable. The first portion of the antenna array module provides a first wireless communication functionality and the second portion of the antenna array module provides a second wireless communication functionality. The flex...