ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,586, issued on Sept. 9, was assigned to APIC YAMADA Corp. (Nagano, Japan).
"Resin-sealing apparatus and resin-sealing method" was invented by Takashi Saito (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-tim...