US Patent Issued to ANSYS on May 20 for "Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learning" (Taiwanese, American, Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,307,184, issued on May 20, was assigned to ANSYS INC. (Canonsburg, Pa.).

"Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learning" was invented by Wen-Tze Chuang (Yilan County, Taiwan), Norman Chang (Fremont, Calif.), Lei Yin (San Jose, Calif.), Bolong Zhang (Tallahassee, Fla.), Xi Chen (Chengdu, China), Jay Prakash Pathak (Pleasanton, Calif.), En Cih Yang (New Taipei, Taiwan), Jimin Wen (Pleasanton, Calif.), Akhilesh Kumar (Milpitas, Calif.), Ming-Chih Shih (Taipei, Taiwan) and Ying Shiun Li (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A specification for a semi-conductor ch...