US Patent Issued to ANSYS on Jan. 27 for "Methods and systems for predicting layer-wise physical behaviors in additive manufacturing" (Utah Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,795, issued on Jan. 27, was assigned to ANSYS INC. (Canonsburg, Pa.).

"Methods and systems for predicting layer-wise physical behaviors in additive manufacturing" was invented by Clancy Umphrey (Park City, Utah).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional model (i.e., MCAD model) for additively manufacturing a physical object with a laser is received in a computer system. The laser is controlled or driven by a set of instructions. The instructions specify scan properties for scanning each of multiple deposit layers during the additive manufacturing. Two-dimensional (2D) maps representing the scan properties for the deposit laye...