ALEXANDRIA, Va., March 5 -- United States Patent no. 12,241,689, issued on March 4, was assigned to Analog Devices Inc. (Norwood, Mass.).
"Heat transfer element" was invented by Marc T. Dunham (Foster City, Calif.) and Baoxing Chen (Westford, Mass.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal por...