US Patent Issued to Analog Devices on July 29 for "Laminate substrate for integrated device packages" (Massachusetts Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,633, issued on July 29, was assigned to Analog Devices Inc. (Wilmington, Mass.).

"Laminate substrate for integrated device packages" was invented by Clement Joseph Wagner (Maynard, Mass.) and Micah Galletta O'Halloran (Andover, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate substrate panel may include an upper layer at or near a top surface of the panel. The laminate substrate panel may include a lower layer at or near a bottom surface of the panel. The laminate substrate panel may also include an array of functional laminate cells, each functional laminate cell of the array having a first upper pattern in the upper layer and a firs...