US Patent Issued to Analog Devices International UnLtd. on April 22 for "Semiconductor packages" (Turkish, American Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,555, issued on April 22, was assigned to Analog Devices International UnLtd. Co. (Co. Limerick, Ireland).

"Semiconductor packages" was invented by Bilge Bayrakci (Istanbul), Abdullah Celik (Istanbul), Winslow Round (Amesbury, Mass.), Santosh Anil Kudtarkar (Ayer, Mass.), Yusuf Atesal (Istanbul) and Turusan Kolcuoglu (Arlington, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semicond...