US Patent Issued to AMULAIRE THERMAL TECHNOLOGY on April 29 for "Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,865, issued on April 29, was assigned to AMULAIRE THERMAL TECHNOLOGY INC. (New Taipei, Taiwan).

"Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins" was invented by Chun-Te Wu (New Taipei, Taiwan), Ching-Ming Yang (New Taipei, Taiwan), Yu-Wei Chiu (New Taipei, Taiwan) and Tze-Yang Yeh (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A two-phase immersion-cooling heat-dissipation composite structure. The heat-dissipation composite structure includes a heat dissipation base, a plurality of high-thermal-conductivity fins, and at least one high-porosit...