US Patent Issued to ams-OSRAM on Oct. 7 for "Semiconductor device with a bond pad and a sandwich passivation layer and manufacturing method thereof" (Dutch Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,744, issued on Oct. 7, was assigned to ams-OSRAM AG (Premstaetten, Austria).

"Semiconductor device with a bond pad and a sandwich passivation layer and manufacturing method thereof" was invented by Ching-Lun Lee (Eindhoven, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a sandwich passivation layer (405) on a semiconductor device (400) comprising a bond pad (404) is provided. The method comprises forming a first layer (406) over a surface of the semiconductor device (400), removing a part of the first layer (406) to expose a surface of the bond pad (404), forming a second layer (407) over the first layer (406) and the ...