US Patent Issued to Amphenol on May 20 for "Mating backplane for high speed, high density electrical connector" (New Hampshire, Massachusetts Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,915, issued on May 20, was assigned to Amphenol Corp. (Wallingford, Conn.).

"Mating backplane for high speed, high density electrical connector" was invented by Mark W. Gailus (Concord, Mass.), Marc B. Cartier Jr. (Durham, N.H.), Vysakh Sivarajan (Nashua, N.H.) and David Levine (Amherst, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least t...