US Patent Issued to Amphenol on Jan. 13 for "High performance interposer and chip socket having contacts with an outer bean and an inner beam" (Pennsylvania Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,735, issued on Jan. 13, was assigned to Amphenol Corp. (Wallingford, Conn.).

"High performance interposer and chip socket having contacts with an outer bean and an inner beam" was invented by Paul R. Taylor (Mechanicsburg, Pa.), Jim Hileman (Carlisle, Pa.) and Trent K. Do (Lititz, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A sec...