ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,995, issued on April 8, was assigned to AMOSENSE Co. LTD. (Cheonan-si, South Korea).
"Power module" was invented by Taejung Kim (Cheonan-si, South Korea), Wonsan Na (Cheonan-si, South Korea), Baegeun Lee (Cheonan-si, South Korea) and Bohyeon Han (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a power module comprising: an upper ceramic substrate (300); a PCB substrate (400) disposed spaced apart from the upper ceramic substrate (300); a plurality of semiconductor chips (G1, G2, G3, G4) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic sub...