US Patent Issued to Amkor Technology Singapore Holding Ptd. on July 29 for "Laser-assisted bonding apparatus for bonding an electronic device to a substrate" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,558, issued on July 29, was assigned to Amkor Technology Singapore Holding Ptd. Ltd. (Singapore).

"Laser-assisted bonding apparatus for bonding an electronic device to a substrate" was invented by Tae Ho Yoon (Daejeon, South Korea), Yang Gyoo Jung (Seoul, South Korea), Min Ho Kim (Seoul, South Korea), Youn Seok Song (Gwangju, South Korea), Dong Soo Ryu (Seongnam-si, South Korea) and Choong Hoe Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser i...