US Patent Issued to Amkor Technology Singapore Holding on Sept. 23 for "Semiconductor devices and methods of manufacturing semiconductor devices" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,525, issued on Sept. 23, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor devices and methods of manufacturing semiconductor devices" was invented by Shigeki Tanaka (Hokkaido, Japan), Hideharu Kamata (Fukushima-ken, Japan) and Katsunori Wako (Miyagi-ken, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, a semiconductor device includes a conductive structure having a conductive structure upper side. A roughening is on the conductive structure upper side and a groove is in the conductive structure extending partially into the conductive structure from the conductive structure upper side. An e...