US Patent Issued to Amkor Technology Singapore Holding on Sept. 16 for "Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,135, issued on Sept. 16, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices" was invented by Masaya Tazawa (Kanagawa, Japan) and Shingo Nakamura (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes providing a substrate having substrate terminals and providing a first component having a first terminal and a second terminal. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupli...