US Patent Issued to AMKOR TECHNOLOGY SINGAPORE HOLDING on Oct. 7 for "Semiconductor package with routing patch and method of fabricating the semiconductor package" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,124, issued on Oct. 7, was assigned to AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. (Singapore).

"Semiconductor package with routing patch and method of fabricating the semiconductor package" was invented by Michael Kelly (Queen Creek, Ariz.), Ronald Patrick Huemoeller (Gilbert, Ariz.) and David Jon Hiner (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for a semiconductor package with high routing density routing patch are disclosed and may include a semiconductor die bonded to a substrate and a high routing density patch bonded to the substrate and to the semiconductor die, wherein the high routing density patch c...