US Patent Issued to Amkor Technology Singapore Holding on Nov. 18 for "Land structure for semiconductor package and method therefor" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,171, issued on Nov. 18, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Land structure for semiconductor package and method therefor" was invented by Kyoung Yeon Lee (Gyeonggi-do, South Korea), Byong Jin Kim (Gyeonggi-do, South Korea), Jae Min Bae (Seoul, South Korea), Hyung Il Jeon (Gyeonggi-do, South Korea), Gi Jeong Kim (Gyeonggi-do, South Korea) and Ji Young Chung (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a...