US Patent Issued to Amkor Technology Singapore Holding on May 27 for "Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,845, issued on May 27, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereof" was invented by Joon Young Park (Seoul, South Korea), Jung Soo Park (Seongnam-si, South Korea) and Ji Hye Yoon (Gwangmyeong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an ad...