US Patent Issued to AMKOR TECHNOLOGY SINGAPORE HOLDING on June 3 for "Semiconductor package using a coreless signal distribution structure" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,731, issued on June 3, was assigned to AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. (Singapore).

"Semiconductor package using a coreless signal distribution structure" was invented by Do Hyung Kim (Gyeonggi-do, South Korea), Jung Soo Park (Gyeonggi-do, South Korea) and Seung Chul Han (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a...