US Patent Issued to Amkor Technology Singapore Holding on June 17 for "Semiconductor devices and methods of manufacturing semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,420, issued on June 17, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor devices and methods of manufacturing semiconductor devices" was invented by Hyeong Il Jeon (Gyeonggi-do, South Korea), Gi Jeong Kim (Gyeonggi-do, South Korea), Yong Ho Son (Incheon, South Korea), Byong Jin Kim (Seoul, South Korea), Jae Min Bae (Seoul, South Korea) and Seung Woo Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can i...