ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,934, issued on July 8, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).
"Method of manufacturing a semiconductor device" was invented by Siang Miang Yeo (Selangor, Malaysia) and Mohd Hasrul Bin Zulkifli (Selangor, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate po...