US Patent Issued to Amkor Technology Singapore Holding on July 15 for "Semiconductor device using EMC wafer support system and fabricating method thereof" (South Korean, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,343, issued on July 15, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor device using EMC wafer support system and fabricating method thereof" was invented by Jin Young Kim (Seoul, South Korea), Doo Hyun Park (Seongnam-si, South Korea), Ju Hoon Yoon (Namyangju-si, South Korea), Seong Min Seo (Seoul, South Korea), Glenn Rinne (Apex, N.C.) and Choon Heung Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of t...