US Patent Issued to Amkor Technology Singapore Holding on Feb. 18 for "Electronic device package and fabricating method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,661, issued on Feb. 18, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Electronic device package and fabricating method thereof" was invented by Jin Young Kim (Seoul, South Korea), No Sun Park (Gwangju-si, South Korea), Yoon Joo Kim (Seoul, South Korea), Seung Jae Lee (Namyangju-si, South Korea), Se Woong Cha (Gwangju-si, South Korea), Sung Kyu Kim (Seoul, South Korea) and Ju Hoon Yoon (Namyangju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Variou...