US Patent Issued to Amkor Technology Singapore Holding on Dec. 9 for "Semiconductor device with through-mold via" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,414, issued on Dec. 9, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor device with through-mold via" was invented by Dong Joo Park (Seoul, South Korea), Jin Seong Kim (Seoul, South Korea), Ki Wook Lee (Seoul, South Korea), Dae Byoung Kang (Kyunggi-do, South Korea), Ho Choi (Seoul, South Korea), Kwang Ho Kim (Kyunggi-do, South Korea), Jae Dong Kim (Seoul, South Korea), Yeon Soo Jung (Seoul, South Korea) and Sung Hwan Cho (Kyunggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to t...