ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,199, issued on Dec. 16, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).
"Semiconductor device and manufacturing method thereof" was invented by Jae Hun Bae (Seoul, South Korea), Won Chul Do (Gyeonggi-do, South Korea), Min Yoo (Seoul, South Korea), Young Rae Kim (Gyeonggi-do, South Korea), Min Hwa Chang (Seoul, South Korea), Dong Hyun Kim (Jeju-si, South Korea), Ah Ra Jo (Gyeonggi-do, South Korea) and Seok Geun Ahn (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a fir...