US Patent Issued to Amkor Technology Singapore Holding on Aug. 12 for "Semiconductor package and fabricating method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,005, issued on Aug. 12, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor package and fabricating method thereof" was invented by Keun Soo Kim (Yongin-si, South Korea), Jae Yun Kim (Namyangju-si, South Korea), Byoung Jun Ahn (Seongnam-si, South Korea), Dong Soo Ryu (Seongnam-si, South Korea), Dae Byoung Kang (Seoul, South Korea) and Chel Woo Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconduc...