US Patent Issued to Amkor Technology Singapore Holding on Aug. 12 for "Device chip scale package including a protective layer and method of manufacturing a device chip scale package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,018, issued on Aug. 12, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Device chip scale package including a protective layer and method of manufacturing a device chip scale package" was invented by Tae Ki Kim (Incheon, South Korea), Jae Beom Shim (Incheon, South Korea), Seung Nam Son (Seoul, South Korea) and Won Chul Do (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, a semiconductor device comprises a redistribution layer (RDL) substrate having a top surface and a bottom surface, wherein the RDL substrate comprises a filler-free dielectric material, an electronic device on the top surfa...