US Patent Issued to Amkor Technology Singapore Holding on April 15 for "Semiconductor device and a method of manufacturing a semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,154, issued on April 15, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor device and a method of manufacturing a semiconductor device" was invented by Se Man Oh (Seoul, South Korea), Kyoung Yeon Lee (Incheon, South Korea), Sang Hyeon Lee (Incheon, South Korea) and Min Cheol Shin (Gyeonggi-Do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over t...