US Patent Issued to Amkor Technology Japan on May 6 for "Semiconductor devices and methods of manufacturing semiconductor devices" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,950, issued on May 6, was assigned to Amkor Technology Japan Inc. (Oita, Japan).

"Semiconductor devices and methods of manufacturing semiconductor devices" was invented by Shojiro Hanada (Kanagawa, Japan) and Shingo Nakamura (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior ...