ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,453, issued on Jan. 27, was assigned to AMD Design LLC (Wilmington, Del.).
"Thermosiphon for computing components" was invented by Ting Yu Lin (Fairfield, N.J.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermosiphon is provided for a computing system. The thermosiphon includes an evaporating portion and a pool portion. The evaporating portion is operable to be in thermal communication with a computing component of the computing system. The evaporating portion is operable to retain an evaporating volume of fluid to lower a temperature of the computing component. The pool portion is in fluid communication with the evaporating portion. The pool p...