US Patent Issued to Amcor Flexibles North America on Dec. 30 for "Microwave package with low pressure venting feature" (Wisconsin, Pennsylvania Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,291, issued on Dec. 30, was assigned to Amcor Flexibles North America Inc. (Neenah, Wis.).

"Microwave package with low pressure venting feature" was invented by Ryan S. Nielson (Appleton, Wis.), James R. Lamb (Appleton, Wis.), Jay D. Hodson (Hortonville, Wis.), Peter M. Chen (Appleton, Wis.) and Jon P. Lazarus (Greencastle, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resealable package configured for heating in a microwave oven having at least one vent capable of relieving an internal pressure from an interior space of the package during heating. To protect the integrity of a resealable fastener, such as a zipper reclose feature, the at lea...