US Patent Issued to Amazon Technologies on Aug. 26 for "Physically aware design of interconnect fabric" (California, Texas Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,063, issued on Aug. 26, was assigned to Amazon Technologies Inc. (Seattle).

"Physically aware design of interconnect fabric" was invented by Sharukh Shahajahan Shaikh (San Jose, Calif.), Fnu Arun Kumar (Palo Alto, Calif.) and Kun Xu (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect fabric in an integrated circuit (IC) device can be hierarchically partitioned into a set of peripheral sub-fabrics and a glue sub-fabric coupled to each of the peripheral sub-fabrics based on the physical design information associated with the IC device. Each of the peripheral sub-fabrics and the glue sub-fabric can be implemented using 2:1 hie...