US Patent Issued to Altera on Jan. 13 for "Scalable 2.5D interface circuitry for data communication operations" (American, Malaysian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,370, issued on Jan. 13, was assigned to Altera Corp. (San Jose, Calif.).

"Scalable 2.5D interface circuitry for data communication operations" was invented by Chee Hak Teh (Bayan Lepas, Malaysia) and Arifur Rahman (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing ...