US Patent Issued to ALPHA ASSEMBLY SOLUTIONS on Sept. 23 for "High reliability lead-free solder alloy for electronic applications in extreme environments" (Illinois Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,421,574, issued on Sept. 23, was assigned to ALPHA ASSEMBLY SOLUTIONS INC. (Waterbury, Conn.).

"High reliability lead-free solder alloy for electronic applications in extreme environments" was invented by Md Hasnine (Glenview, Ill.) and Lik Wai Kho (Glenview, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth ma...