US Patent Issued to ALPHA ASSEMBLY SOLUTIONS on Oct. 7 for "Sintering materials and attachment methods using same" (New Jersey, Pennsylvania Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,121, issued on Oct. 7, was assigned to ALPHA ASSEMBLY SOLUTIONS INC. (Waterbury, Conn.).

"Sintering materials and attachment methods using same" was invented by Oscar Khaselev (Monmouth Junction, N.J.), Bawa Singh (Marlton, N.J.), Bin Mo (East Brunswick, N.J.), Michael T. Marczi (Chester, N.J.) and Monnir Boureghda (East Stroudsburg, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an ...