US Patent Issued to Alpha Assembly Solutions on Feb. 25 for "Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications" (Connecticut Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,233,483, issued on Feb. 25, was assigned to Alpha Assembly Solutions Inc. (Waterbury, Conn.).

"Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications" was invented by Rahul Raut (Waterbury, Conn.), Nirmalyakumar Chaki (Waterbury, Conn.), Bawa Singh (Waterbury, Conn.), Ranjit Pandher (Waterbury, Conn.) and Siuli Sarkar (Waterbury, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from...