ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,042, issued on Aug. 12, was assigned to Alpha Assembly Solutions Inc. (Waterbury, Conn.).
"Solder material and method for die attachment" was invented by Angelo Gulino (Cranbury, N.J.), Bogdan Bankiewicz (Philadelphia), Oscar Khaselev (Monmouth Junction, N.J.), Anna Lifton (Bridgewater, N.J.), Michael T. Marczi (Chester, N.J.), Girard Sidone (Bordentown, N.J.), Paul Salerno (Bridgewater, N.J.) and Paul J. Koep (Madison, N.J.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m...