US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on Oct. 7 for "Semiconductor power module package having lead frame anchored bars" (South Korean, American Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,069, issued on Oct. 7, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto).

"Semiconductor power module package having lead frame anchored bars" was invented by Zhiqiang Niu (Santa Clara, Calif.), Bum-Seok Suh (Seongnam, South Korea), Junho Lee (Suwon-si, South Korea), Jong-Mu Lee (Yongin-si, South Korea), Jun Lu (San Jose, Calif.) and Xiaorong Ge (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a lead frame, a substrate mounted on the lead frame, a first anchor pad, a second anchor pad, a plurality of die pads, and a plurality of transistor dies. The lead frame includes a first lead fram...