US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on March 25 for "Semiconductor package having wettable lead flanks and tie bars and method of making the same" (American, Chinese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,101, issued on March 25, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto).

"Semiconductor package having wettable lead flanks and tie bars and method of making the same" was invented by Yan Xun Xue (Los Gatos, Calif.), Madhur Bobde (Sunnyvale, Calif.), Long-Ching Wang (Cupertino, Calif.) and Xiaoguang Zeng (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lead frame, a chip, and a molding encapsulation. The lead frame comprises a die paddle, a first plurality of leads, additional one or more leads, a second plurality of leads, a first tie bar, a second tie bar, a third tie bar, and a...