US Patent Issued to Allegro MicroSystems on April 22 for "Sensor package and system" (American, French, German Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,282,075, issued on April 22, was assigned to Allegro MicroSystems LLC (Manchester, N.H.).

"Sensor package and system" was invented by Simon E. Rock (Heidelberg, Germany), Georges El Bacha (Manchester, N.H.), Shaun D. Milano (Charlestown, N.H.), Loic Andre Messier (Vanzy, France), Alexander Latham (Harvard, Mass.), Maxwell McNally (Manchester, N.H.) and Shixi Louis Liu (Hooksett, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad ...