ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,728, issued on Jan. 20, was assigned to AIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Backside leakage prevention" was invented by Harry-Haklay Chuang (Hsinchu, Taiwan), Wen-Tuo Huang (Tainan, Taiwan), Wei-Cheng Wu (Hsinchu County, Taiwan) and Ching I Li (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure according to the present disclosure includes a bottom substrate, a bottom interconnect structure over the bottom substrate, a top interconnect structure disposed over the bottom interconnect structure and including a metal feature, a top substrate over the top interconnect structure, and a protec...