US Patent Issued to Aito on Jan. 20 for "Haptic touch module and a method for manufacturing the haptic touch module" (Finnish Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,082, issued on Jan. 20, was assigned to Aito BV (Amsterdam).

"Haptic touch module and a method for manufacturing the haptic touch module" was invented by Panu Perko (Espoo, Finland) and Jari Toropainen (Espoo, Finland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A haptic touch module (124, 170) comprises a bottom plate (100, 140) comprising a recess (102, 172); a haptic sensor (104, 152) mounted in the recess (102, 172); a capacitive sensor printed circuit board assembly (106, 160) mounted on the haptic sensor (104, 152); and an overlay (108, 164) mounted on the capacitive sensor printed circuit board assembly (106, 160), the overlay (108, 164) ha...