US Patent Issued to Airoha Technology (HK) on June 10 for "Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductance" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,806, issued on June 10, was assigned to Airoha Technology (HK) Ltd. (North Point, Hong Kong).

"Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductance" was invented by Huan-Sheng Chen (Hsinchu County, Taiwan), Ming-Yin Ko (Hsinchu County, Taiwan) and Chun-Wei Chen (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire...