US Patent Issued to Airoha Technology (HK) on April 15 for "Semiconductor package with conductive adhesive that overflows for return path reduction and associated method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,206, issued on April 15, was assigned to Airoha Technology (HK) Ltd. (North Point, Hong Kong).

"Semiconductor package with conductive adhesive that overflows for return path reduction and associated method" was invented by Chun-Wei Chen (Hsinchu County, Taiwan), Yan-Bin Luo (Taipei, Taiwan) and Ming-Yin Ko (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a printed circuit board (PCB), a semiconductor device, an interposer, and a conductive adhesive. The PCB has a top surface with at least one ground area formed thereon. The semiconductor device has a bottom surface with at least one first first-t...