US Patent Issued to AGC on Sept. 16 for "Method of producing SiC-Si composite component and SiC-Si composite component" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,762, issued on Sept. 16, was assigned to AGC INC. (Tokyo).

"Method of producing SiC-Si composite component and SiC-Si composite component" was invented by Kenji Yamada (Tokyo), Kenichiro Terada (Tokyo), Nobuhiro Shinohara (Tokyo), Shinya Kikugawa (Tokyo), Yasuo Shinozaki (Tokyo) and Shunsuke Susa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a method of producing a SiC-Si composite component. The method includes preparing a first molded body containing SiC particles by a 3D printing method, wherein the first molded body has a first average pore diameter M1; forming a second molded body, in which the first mo...