US Patent Issued to AGC on Nov. 11 for "Roll film, method for producing roll film, method for producing copper-clad laminate and method for producing printed board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,927, issued on Nov. 11, was assigned to AGC Inc. (Tokyo).

"Roll film, method for producing roll film, method for producing copper-clad laminate and method for producing printed board" was invented by Seigo Kotera (Chiyoda-ku, Japan), Wataru Kasai (Chiyoda-ku, Japan), Junetsu Nakamura (Chiyoda-ku, Japan) and Takatoshi Yaoita (Chiyoda-ku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a dielectric film which is excellent in dielectric properties and stability in the electric corrosion test and which is suitable for producing a high-precision printed board.A roll film comprising a melt-processable fluororesin as the main component and ...