ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,539, issued on July 8, was assigned to AGC GLASS EUROPE (Louvain-la-Neuve, Bulgaria), AGC INC. (Chiyoda Ku, Japan), AGC FLAT GLASS NORTH AMERICA INC. (Alpharetta, Ga.) and AGC VIDROS DO BRADIL LTDA (Sao Paulo).

"Laminated assembly comprising radio-frequency interface board" was invented by Mohsen Yousefbeiki (Gosselies Select, Belgium) and Rafik Addaci (Gosselies Select, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "An improved RF interface board and a laminated assembly having a RF interface board having an inner and an outer part. The laminated assembly includes a dielectric support having a first and a second surfaces and at least a first...