US Patent Issued to AGASemicon on Nov. 4 for "Transfer resin for transferring an LED chip, and an apparatus for transferring an LED chip by using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,857, issued on Nov. 4, was assigned to AGASemicon Corp. (Yongin-si, South Korea).

"Transfer resin for transferring an LED chip, and an apparatus for transferring an LED chip by using the same" was invented by Jae Sik Min (Yongin-si, South Korea), Jae Yeop Lee (Yongin-si, South Korea), Jae Suk Park (Yongin-si, South Korea) and Byoung Gu Cho (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a transfer technology using a technique of transferring LED chips formed on a wafer to another carrier substrate and display panel, a transfer resin, and an apparatus for transferring an LED chip and a display pa...