US Patent Issued to Aeva on June 10 for "Techniques for singulating photonics die with optical quality edge" (Texas, California Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,326,593, issued on June 10, was assigned to Aeva Inc. (Mountain View, Calif.).

"Techniques for singulating photonics die with optical quality edge" was invented by Brett E. Huff (Keller, Texas) and Pradeep Srinivasan (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of singulating a die of a wafer includes etching a trench on a first surface of a wafer comprising a die and performing a cut on a second surface of the wafer, wherein the cut overlaps with the trench on the first surface of the wafer to separate the die from the wafer."

The patent was filed on Jan. 26, 2024, under Application No. 18/424,201.

*For further information...